Energy Storage Science and Technology ›› 2022, Vol. 11 ›› Issue (6): 1980-1987.doi: 10.19799/j.cnki.2095-4239.2021.0656

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Numerical study on cooling enhancement of micro devices by designing turbulence based hollow micro pin-fin arrays with lateral holes

WU Xiaoling1(), ZHOU Tao2, LIU Yuzhao2, DU Yanping2(), CHEN Huiping1, LI Shun1   

  1. 1.Wanbao Group Compressor Co. , Ltd. , Guangzhou 510740, Guangdong, China
    2.China-UK Low Carbon College, Shanghai Jiao Tong University, Shanghai 201306, China
  • Received:2021-12-07 Revised:2022-01-09 Online:2022-06-05 Published:2022-06-13
  • Contact: DU Yanping E-mail:wuxiaoling@gzwbgc.com;yanping.du@sjtu.edu.cn

Abstract:

This paper investigates the heat transfer performance with air convection for different heat sink structures, in order to gain insight into the influence of microstructures on the heat transfer performance of heat sinks and to achieve efficient cooling under different operating conditions. By changing the simulation conditions, such as flow direction, flow velocity, and heat flux, the numerical simulation method of computational fluid dynamics is used to study the heat transfer efficiency and airflow of heat sinks with different microstructures. It has been discovered that heat sinks with hollow micro pin-fin arrays have a better cooling effect than heat sinks with micro plate-fin arrays or hybrid arrays. The benefit of hollow micro pin-fin arrays is that they promote local turbulence of air around them, which increases the average flow rate of cold air in the near-wall boundary layer. In the case of the vertical inflow, the design allows for the best use of air kinetic energy to flush the surface inside and outside the micro-pillar, improving convective heat transfer efficiency. According to the analysis, as the height of the microstructure increases, the percentage of heat transfer enhancement decreases. Meanwhile, as the microstructure density varies, there is a peak in the average heat transfer coefficient of the heat sink. This indicates the existence of an optimal value for the microstructure parameters when material utilization is taken into account. When compared to heat sinks with conventional micro plate-fin arrays, the newly optimized hollow micro pin-fin arrays at a height of 5 mm and pitch of 6 mm can reduce the average temperature of heat sink by 10%-15%, ensuring the efficient performance of microdevices in a variety of working conditions.

Key words: heat sink, hollow micro pin-fin, forced convection, numerical simulation, heat transfer performance

CLC Number: