Energy Storage Science and Technology ›› 2024, Vol. 13 ›› Issue (8): 2597-2604.doi: 10.19799/j.cnki.2095-4239.2024.0230

• Energy Storage Materials and Devices • Previous Articles     Next Articles

Experimental study of a novel mini-channel phase change heat sink

Yu LI1(), Junxiong ZHANG2, Hongming FAN1()   

  1. 1.Beijing Key Laboratory of Green Building and Energy-Efficiency Technology, Beijing University of Technology, Beijing 100124, China
    2.CSIC (Beijing) Research Management Co. , Ltd. , Beijing 100097, China
  • Received:2024-03-15 Revised:2024-04-05 Online:2024-08-28 Published:2024-08-15
  • Contact: Hongming FAN E-mail:Li-yu@emails.bjut.edu.cn;fanhm@bjut.edu.cn

Abstract:

The integration and miniaturization of electronic components have aggravated the heat flux problem of chips. The passive cooling technology based on phase-change materials (PCMs) can no longer meet the requirements of high-power electronic devices with power fluctuations. This paper proposes a novel mini-channel phase-change heat sink structure for air-cooled heat dissipation by combining phase-change technology with active cooling technology. The structure improves the poor thermal conductivity of PCMs and resolves the leakage problem after PCM melting. The effects of different heat fluxes and air velocities on its thermal control performance are experimentally evaluated. The heat storage and release characteristics of hybrid heat sinks are summarized, and the thermal control performance is compared with that of unfilled PCM heat sinks. In the experiment, the heat flux is 1.81—3.47 W/cm2 and the airspeed is 0—4 m/s. The result shows that an increase in heat flux and a decrease in air velocity shorten the temperature control time. The 2 m/s air velocity is sufficient to meet the heat dissipation demand with a heat flux of less than 2.91 W/cm2. The 4 m/s air velocity can maintain the heat sink substrate temperature at 70 ℃ with a 3.47 W/cm2 heat flux. Unlike the unfilled PCM heat sink, the heat sink proposed in this study can extend the temperature control time and reduce the steady-state temperature. Furthermore, opening the fan can effectively shorten the cooling time of the heat sink, which is crucial for the application of electronic devices that work intermittently. This study's results can provide a reference for the practical application of mini-channel phase-change heat sinks.

Key words: phase change thermal storage, thermal control performance, mini-channel, air cooling

CLC Number: