Advancements in polyethylene glycol-based form-stable composite phase change materials

doi:10.19799/j.cnki.2095-4239.2024.1159

Abstract

Abstract:

Latent heat storage technology based on phase change materials (PCMs) has received extensive attention in recent years. Polyethylene glycol (PEG) is a non-toxic organic solid-liquid PCM with high latent heat. Compared to other organic PCMs, its excellent biocompatibility, adjustable phase change temperature, and tunable enthalpy make PEG highly versatile in thermal management, wearable devices, and other fields. However, its low thermal conductivity and leakage during solid-liquid phase transformation limit its practical applications. To address these problems, many methods have been developed to stabilize PEG. Besides commonly used physical methods such as blending, coating, and adsorption, the active hydroxyl groups at both ends of PEG enables its conversion into a solid-solid PCM through chemical modification. Herein, different techniques, including physical blending, microcapsule, fiber, porous material adsorption, and chemical modification, for preparing PEG-based form-stable composite PCMs are reviewed, and their properties are compared. Additionally, recent advances in PEG-based PCMs for the thermal management of electronic devices, photothermal conversion, building energy efficiency, and wearable devices are discussed. Finally, challenges such as low thermal conductivity and reduced enthalpy during composite processing are analyzed, and future research directions are outlined.

Key words: phase change material, polyethylene glycol, form-stable phase change, composite material

CLC Number:

TB 34

Ruixing QUAN, Wenjing MIAO, Changshun YUAN, Guanggui CHNEG, Yanqi ZHAO. Advancements in polyethylene glycol-based form-stable composite phase change materials[J]. Energy Storage Science and Technology, 2025, 14(3): 1010-1025.

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相变材料	分类	熔化温度/℃	相变潜热/(J/g)	热导率/[W/(m⋅K)]
聚乙二醇(PEG)	醇类有机相变材料	37.1～67.0	161.18～197.2	0.29～0.33
月桂酸(LA)	脂肪酸类有机相变材料	44	212	0.22
癸酸	脂肪酸类有机相变材料	32	163	0.15
硬脂酸(SA)	脂肪酸类有机相变材料	70	199	0.17
正十八烷	石蜡类有机相变材料	28	244	0.36
正二十烷	石蜡类有机相变材料	40	213	0.21
六水氯化钙(CaCl₂·6H₂O)	水合盐类无机相变材料	29.6	191	1.09
十水硫酸钠(Na₂SO₄·10H₂O)	水合盐类无机相变材料	32	180	0.56
三水乙酸钠[Na₂(CH₃COO)₃H₂O]	水合盐类无机相变材料	58	266	0.43

聚乙二醇	多孔材料	制备方法	负载量/%	熔融温度/℃	熔融焓值/(J/g)
PEG-2000	膨胀蛭石(PAL)^[47]	真空浸渍	66.16	35.81/41.63	55.25
PEG-6000	膨胀珍珠岩(EP)^[48]	真空浸渍	72.61	59.6	142.8
PEG-800	脱木素高粱秸秆(DSS)^[49]	真空浸渍	—	28.21	98.71
PEG-6000	硅藻土^[50]	浸渍和真空蒸发	60	56.8	107.4
PEG	多孔碳(CF)^[53]	熔融浸渍	75	50.45	81.76
PEG-4000	三聚氰胺泡沫(MF)^[57]	真空浸渍	98.3	54.5	186.2±4.4
PEG-1500	泡沫铜(CF)^[58]	熔融浸渍	—	46	155.74
PEG-4000	多孔马铃薯^[59]	真空浸渍	82.1	51.26	139.88

聚乙二醇类型	异氰酸酯类型	其他填料	熔融温度/℃	熔融焓值/(J/g)
PEG-4000, 6000,8000,10000, 12000	TDI^[70]	三聚氰胺，石墨烯纳米片(GNP)	36.7～59.8	最大118.7
PEG-4000	MDI^[71]	有机蒙脱石(OMMT)	54.97	106.8
PEG-10000	MDI^[72]	氧化石墨烯(GO)	61.81	138.12
PEG-8000	MDI^[73]	氧化石墨烯(GO)	65.3	158.2
PEG-8000	MDI^[74]	石墨纳米片(GNP)	54.6	164.4
PEG-8000	MDI^[75]	多壁碳纳米管(MWCNT)	58.7	113.5
PEG-4000	MDI^[76]	聚乙烯醇(PVOH)	51.11	144.14
PEG-6000	IPDI^[77]	铁离子	—	97.6
PEG-2000，4000	IPDI^[84]	丁二醇(BDO)	—	56.93/79.23
PEG-6000	HMDI^[78]	多壁碳纳米管(MWCNT)	24.91	64.81
PEG-8000	H₁₂MDI[4,4'-亚甲基双(环己基异氰酸酯)]^[85]	三苯乙烯基苯酚聚乙二醇醚(Emulsogen TS200)	59.08	129.59
PEG-6000	HDI^[79]	泡沫石墨(GF)	43.8	60.3
PEG-10000	HDI^[80]	木粉(WF)	63.5	134.2
PEG-3000	HDI^[81]	碳纳米管(CNT)	42	85.9
PEG-6000	HDIT^[82]	—	64.8	136.8
PEG	HDIT^[83]	MXene	—	132.82
PEG-4000	HDIB(六亚甲基二异氰酸酯缩二脲)^[86]	网状石墨纳米片(RGNPs)	46.5	163.5

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