新型迷你通道-相变热沉实验研究

doi:10.19799/j.cnki.2095-4239.2024.0230

摘要/Abstract

摘要：

电子元件的集成化、微型化等特点加剧了芯片的热问题，基于相变材料的被动式冷却技术已无法满足功率波动的高功率电子设备的需求。本文将相变技术与主动冷却技术相结合，提出了一种用于风冷散热的新型迷你通道-相变热沉结构。该结构改善了相变材料导热性能差的问题，也解决了相变材料熔化后泄漏的问题。通过实验测试了不同热流密度、不同风速对其热控性能的影响，总结了热沉的蓄放热特性，并与未填充相变材料热沉的热控性能进行了对比。实验中热流密度变化范围为1.81~3.47 W/cm²，风速变化范围为0~4 m/s。研究表明：热流密度的增大和风速的降低均会导致热沉温控时间的缩短。2 m/s风速足以满足热流密度小于2.91 W/cm²的芯片散热需求，4 m/s风速可以在热流密度为3.47 W/cm²的情况下将热沉底面温度维持在70 ℃。与未填充相变材料热沉相比，本研究提出的热沉可以起到延长温控时长，降低稳态温度的作用。此外，风扇的开启可以有效缩短热沉的冷却时间，对于间歇性工作的电子设备具有重要的应用意义。研究结果可为迷你通道-相变热沉在实践中的应用提供参考依据。

关键词: 相变蓄热, 热控性能, 迷你通道, 风冷散热

Abstract:

The integration and miniaturization of electronic components have aggravated the heat flux problem of chips. The passive cooling technology based on phase-change materials (PCMs) can no longer meet the requirements of high-power electronic devices with power fluctuations. This paper proposes a novel mini-channel phase-change heat sink structure for air-cooled heat dissipation by combining phase-change technology with active cooling technology. The structure improves the poor thermal conductivity of PCMs and resolves the leakage problem after PCM melting. The effects of different heat fluxes and air velocities on its thermal control performance are experimentally evaluated. The heat storage and release characteristics of hybrid heat sinks are summarized, and the thermal control performance is compared with that of unfilled PCM heat sinks. In the experiment, the heat flux is 1.81—3.47 W/cm² and the airspeed is 0—4 m/s. The result shows that an increase in heat flux and a decrease in air velocity shorten the temperature control time. The 2 m/s air velocity is sufficient to meet the heat dissipation demand with a heat flux of less than 2.91 W/cm². The 4 m/s air velocity can maintain the heat sink substrate temperature at 70 ℃ with a 3.47 W/cm² heat flux. Unlike the unfilled PCM heat sink, the heat sink proposed in this study can extend the temperature control time and reduce the steady-state temperature. Furthermore, opening the fan can effectively shorten the cooling time of the heat sink, which is crucial for the application of electronic devices that work intermittently. This study's results can provide a reference for the practical application of mini-channel phase-change heat sinks.

Key words: phase change thermal storage, thermal control performance, mini-channel, air cooling

中图分类号:

TK 124

李煜, 张俊雄, 樊洪明. 新型迷你通道-相变热沉实验研究[J]. 储能科学与技术, 2024, 13(8): 2597-2604.

Yu LI, Junxiong ZHANG, Hongming FAN. Experimental study of a novel mini-channel phase change heat sink[J]. Energy Storage Science and Technology, 2024, 13(8): 2597-2604.

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物性	类值
相变温度/℃	51.6~58.2
相变潜热/(J/kg)	220000
比热容/[J/(kg·K)]	2000
密度(固/液)/(kg/m³)	830/730

仪器	型号	物理量	相对不确定度
多功能通风表	TSI-9565P	风速	± 1.5%
数据采集器	Agilent 34970A	—	—
热电偶	T型	温度	± 0.1 ℃
功率计	PF-9800	功率	± 0.5%

物理量	范围	相对不确定度
q	1.81~3.47 W/cm²	0~0.73%
R	0~1	0~2.49%

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