Study on thermal equalization of spider web thermal structure based on topology optimization method

doi:10.19799/j.cnki.2095-4239.2023.0672

Abstract

Abstract:

The bionic spider cooling structure is widely employed in dissipating heat from high heat flux chips, yet it faces challenges with uneven temperature distribution. To enhance the temperature uniformity within the spider web's thermal structure, this study introduces variable density topology optimization to refine the design. The optimization process aims to minimize temperature variance across the design domain, utilizing Holmz density filtering for numerical stability and hyperbolic tangential projection to define clear flow paths. Analysis of the heat transfer efficiency in topologically optimized flow paths, considering various inlet and outlet configurations and shapes across different design domains, revealed that a staggered multi-inlet and multi-outlet arrangement significantly enhances temperature equalization. Additionally, it was observed that the average temperature of the topological channel increases when the design domain comprises fewer than 10 edges. Comparative simulations using the finite element analysis method were conducted on a traditional structure (M1) and three-dimensional topological reconstructions (M2 and M3) with varying edge numbers in the design domain. The results demonstrated superior temperature uniformity in M3, which has 10 edges, compared to M1 and M2 with 6 edges. At a Reynolds number (Re) of 1800, M3 exhibited an 18.48% reduction in thermal resistance and a 25% decrease in the heat source surface temperature difference compared to M1, achieving a performance evaluation criteria value of 1.22. This study not only validates the effectiveness of the topology optimization method in enhancing the thermal structure's temperature equalization but also advocates for its broader application in thermal management systems.

Key words: spider structure, topology optimization, numerical simulation, homothermy

CLC Number:

TG 156

Kan ZHANG, Ting FU, Jiangbo WANG. Study on thermal equalization of spider web thermal structure based on topology optimization method[J]. Energy Storage Science and Technology, 2024, 13(5): 1721-1730.

Figures/Tables 17

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参数	数值
热源/(W/m²)	1e-6
流体黏度/(Pa·s)	0.001
流体密度/(kg/m³)	1000
流体导热系数/[W/(m·K)]	0.6
流体比热容/[J/(kg·K)]	4200
固体密度/(kg/m³)	2700
固体导热系数/[W/(m·K)]	237
固体比热容/[J/(kg·K)]	900
进口温度/K	293.15
投影系数	6
收敛误差条件	1e-6
达西数	1e-4

符号	具体数值/mm	符号	具体数值/mm
H整体高度	4.5	L_ch通道宽度	0.8
H_ch流道高度	1.5	W_ch入口宽度	1.5
L整体长度	20	W整体宽度	18

项目	网格1/相对(网格2)误差	网格2	网格3/相对(网格2)误差
网格数量	647021	1453017	2865300
基板平均温度/K	345.58/0.20%	344.89	345.06/0.05%
压降/Pa	199.27/1.05%	197.2	198.99/0.91%

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